Testing
Our testing processes are an integral part of manufacturing and are individually adapted to your requirements. By combining proven technologies with customer-specific solutions, we ensure maximum functionality and quality. For high volumes, we offer automated inline ICT/FT testing infrastructure with integrated panel separation – efficient, scalable, and reliable.
- AOI (Automated Optical Inspection)
AOI optically inspects component placement and solder joints, enabling fast, automated detection of defects on the PCB.
- AXI (Automated X-Ray Inspection)
AXI enables non-destructive X-ray inspection of hidden solder joints and complex assemblies to ensure the highest quality standards.
- FPT (Flying Probe Test)
Flying probe testing verifies electrical parameters flexibly without special fixtures – ideal for prototypes and small series.
- ICT (In-Circuit Test)
ICT precisely and efficiently verifies the electrical function of individual components in the circuit to ensure stable series production.
- FT (Functional Test)
Functional testing ensures that the electronic assembly operates correctly in its intended application environment and fulfills all specified functions.
- HVT (High Voltage Test)
High voltage testing verifies electrical insulation and voltage resistance to guarantee the safety and reliability of assemblies.
